Estudio Echecopar, associated with Baker & McKenzie International, has assisted Stracon Technologies in the acquisition of a 100% stake in Deep Pit Technology, a Peruvian startup dedicated to the development of artificial intelligence (AI) software for
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Estudio Echecopar, associated with Baker & McKenzie International, has counselled Coöperatieve Rabobank on a syndicated loan granted jointly with Banco Santander Peru and Banco Interamericano de Finanzas in favour of Complejo Agroindustrial Beta in
Estudio Echecopar, associated with Baker & McKenzie International, has counselled Credicorp Capital Servicios Financieros and Banco Santander Peru, as arrangers, on a syndicated loan for up to $40 million US dollars granted by Banco de Cré
Estudio Echecopar, associated with Baker & McKenzie International, has assisted the lenders, administrative agent, bookrunners, coordinators and arrangers in an unsecured revolving loan granted in favour of Sociedad Minera Cerro Verde in the amount of $350,000,000.00
Estudio Echecopar, associated with Baker & McKenzie International, has assisted Agrovision in a $210 USD million financing. The financing consisted of a $180 million USD secured syndicated loan and a $30 million USD unsecured syndicated loan. As a
Estudio Echecopar, associated with Baker McKenzie International, has assisted Perurail and entities of its economic group acting as guarantors, in a senior loan for $65,000,000 US dollars. The loan was guaranteed under New York law, and
Estudio Echecopar, associated with Baker & McKenzie International, has represented Peru Belmond Hotels and entities of its group acting as guarantors, in a senior loan for $30,000,000.00 US dollars. The loan was granted by Banco Santander
Estudio Echecopar, associated with Baker & McKenzie International, has counselled Scotiabank Peru, in its capacity as lead arranger, in the first comprehensive amendment to the Credit Agreement between The Bank of Nova Scotia, and Union
Estudio Echecopar has counselled Consorcio Transmantaro on its 5.200% senior bond issue